Optimized Process Performance Using the ParamountTM/Navigator® Power-Delivery/Match Solution

One of the byproducts of shrinking features is increasingly complex film stacks and masking structures. Especially at critical levels, the simple deposit, pattern, and then etch process flows are no longer adequate. As an example, today’s etch processes often must account for anti-reflective coatings, hard masks, cap layers, and stop layers in the process recipe, while accurately etching the primary layer, which may comprise multiple compositions and doping profiles. In some cases, eight or more layers are involved in the patterning and etching of a single critical device level [1]. Adding to the challenge is the dissimilar chemistry required to etch the various layers and an increasing need to accomplish such complex stack patterning with the fewest number of individual wafer cycles [2].